Tata group and Simmtech announce their plans to boost the semiconductor industry by setting up plants in the state. Union Minister Ashwini Vaishnaw and experts concede the need to develop and hire a vast pool of talent
After US chipmaker Micron, Tata group and Simmtech announced their plans to boost the semiconductor industry in Gujarat. During the 10th Vibrant Gujarat Global Summit, N Chandrasekaran, chairman of Tata group, mentioned that the company is on the verge of concluding and announcing “a huge semiconductor fabrication unit in Dholeraâ€. The operations are expected to commence this year.
Another firm, South Korea’s Simmtech, has signed an MoU with the Gujarat government to set up a plant near the Micron plant in Sanand. The company is the world’s largest manufacturer of semiconductor substrate, the supporting material upon which the elements of a semiconductor device are fabricated.
During his address at the inaugural session of the summit, Jeffery Chun, global CEO, Simmtech, mentioned its previous co-location investments with Micron in China and Malaysia, adding that the company was looking forward to replicating the success in India as well. He said Simmtech was committed to boosting the growth of the semiconductor ecosystem in the country and creating an uninterrupted supply chain network.
This unit will be set up in Sanand, near Ahmedabad, at a cost of Rs1,250 crore, said Ashwini Vaishnaw, Union Minister for Electronics and Information Technology. Simmtech will support Micron's semiconductor plant in Gujarat.
In addition to this, Micron also signed an MoU with the New Age Makers Institute of Technology (NAMTECH), an ArcelorMittal Nippon Steel India education initiative, to develop talent for its semiconductor operations in India. The US-based firm has hired over 200 employees for its plant in India, which will begin operations by the first half of 2025. Three months after signing an agreement with the government of India, the chip-making giant commenced the construction of a factory in September 2023.